Tlam SS 1KA 06

https://www.lairdtech.com/products/tlam-ss-1ka-06
  • Tlam SS 1KA 06

Overview: Tlam SS 1KA Series

Thermally Conductive Printed Circuit Board Substrate

Tlam SS 1KA is a thermally conductive printed circuit board (PCB) substrate. The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird 3 watt/m-K 1KA dielectric. Tlam SS 1KA materials are processed through standard FR4 print and etch operations.

Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire bond processes.

Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with ceramic devices.

Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper base plates are also available.

  • UL 746B Electrical/Mechanical RTI as high as 130?C
  • RoHS compliant
  • Environmentally green
  • Lead-free solder compatible
  • Compliant for low bond stress
  • Chemical Properties:
  • Water Absorption after 168hours - 0.5
  • Out-gassing total mass loss - 0.57
  • Collect Volatile Condensable Material - 0.06
  • Additional Description
    Typical value, for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Peel strength is measured with 1oz Cu.
  • Applications
    • Network DC/DC power converters
    • Battery powered equipment DC/DC power converters
    • Ultra bright LED substrates
  • CTE in XY/Z axis
    , < Tg 32/43, > Tg Sep-19
  • Capacitance
    at 1 KHz 161
  • Comparative Tracking Index
    600
  • Continuous AC
    120
  • Continuous DC
    225
  • Dielectric Constant Range
    1 kHz 4.3
  • Dielectric Strength
    650 (25.6)
  • Dielectric Thickness
    0.006 (0.152)
  • Dissipation Factor at 1KHz
    0.008
  • Elongation at break
    0.8 @25C
    1.0 @150C
  • Flexural Strength (MPa)
    49.70
  • Glass Transition Temperature (°C)
    105
  • Peak Recurring
    300
  • Peel Strength
    4.5 (0.8)
  • Poisson’s Ratio @ 25/150°C
    1 5/8
  • Product Line
    Tlam SS 1KA Series
  • Solder Float (4 min. @ 288°C)
    Pass
  • Soldering Temperature Maximum
    288
  • Surface Resistivity
    1.00E+10
  • Temperature - Operating (Max Celsius)
    120.00
  • Tensile Strength
    del 52.2
  • Thermal Conductivity (W/mK)
    3.00
  • Thermal Resistance (°C-in²/W)
    0.08 (0.52)
  • UL Continuous Operating Temperature (°C)
    120
  • UL Flammability
    94V0
  • Volume Resistivity
    Volume Resistivity Del 1.2
  • Youngs Modulus
    at 25/150C 3 16/27
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Tlam SS 1KA 06

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