TiWi-uB2 Bluetooth Module

Not Recommended for New Design (NRND)

Overview

Bluetooth Smart Ready Module

The TiWi-uB2 Bluetooth module is a high performance 2.4 GHz Bluetooth 2.1+EDR and Bluetooth Low Energy (LE) - Smart Ready radio in a cost effective, pre-certified footprint. The highly integrated TiWi-uB2 module makes the use of Bluetooth headsets and other applications possible. This module fully supports the dual mode Bluetooth and Bluetooth LE operation, and the output power can support class 1.5. The SIP module provides UART interface/audio PCM interface for Bluetooth through the HCI transport layer.

The SIP module is specifically developed for Smart phones and Portable devices.

Specifications

Bluetooth Version
Bluetooth 2.1+EDR, 4.0 (Bluetooth LE)
Output Power
10 dBm
Chipset
TI CC2564
Antenna Options
External via Trace Pad
BT Capable
Complete Power-Optimized Stack
Controller and Host
GAP - Central, Peripheral, Observer, or Broadcaster
ATT / GATT - Client and Server
SMP - AES - 128 Encryption and Decryption
L2CAP
Certifications
FCC, ISED, EU, UKCA, MIC, Bluetooth SIG
Dimension (Height - mm)
7 mm
Dimension (Length - mm)
7 mm
Dimension (Width - mm)
1.5 mm
Interfaces - General
HCI, UART, and Audio PCM interfaces. Compact design based on TI CC2564 Transceiver
Operating Temp (Max) (°C)
+85 °C
Operating Temp (Min) (°C)
-30 °C
Receive Sensitivity
-93 dBm, GFSK at 0.1% BER
-85 dBm, 8DPSK at 0.01% BER
Transmit Current
47.1 mA, DM1 Packet
30.2 mA, DH1 Packet
13.0 mA, DH5 Packet
Voltage
VBAT Min, VDD_IO Min: 2.2 V to 1.62 V
VBAT Max, VDD_IO Max: 4.8 V to 1.92 V
Part NumberAdditional DescriptionAntenna TypeChipset (Wireless)Frequency Range (Max)Frequency Range (Min)Logical InterfacesOS/SoftwareProduct TypeSystem ArchitectureTechnology
450-0104
End of Life (EOL)
Buy Now
TiWi-uB2 Module, Tray External TI CC2564 2480 MHz2402 MHzSerial, PCM HCI Embedded Module Hosted Bluetooth 2.1 + EDR, Dual Mode (Classic + BLE)
450-0104R
End of Life (EOL)
Buy Now
TiWi-uB2 Module, TR External TI CC2564 2480 MHz2402 MHzSerial, PCM HCI Embedded Module Hosted Bluetooth 2.1 + EDR, Dual Mode (Classic + BLE)

Development Kits

  • 450-0105

    450-0105

    Additional Description
    TiWi-uB2 EM Board
    Antenna Type
    External
    Logical Interfaces
    Serial, PCM
    Learn More

Documentation

Name Part Type Last Updated
Bluetooth Eval Tool All Software 03/29/2019
Bluetooth Patch File: ETSI BT 4.0 all certified antennas All Software 03/29/2019
Bluetooth Patch File: FCC/IC/ETSI BT 2.1 + EDR, FCC/IC BT 4.0 all certified antennas All Software 03/29/2019
Bluetooth Patch File: Used with the Bluetooth Eval Tool All Software 03/29/2019
WLAN and Bluetooth Radio Tools User Guide All Software 05/01/2019
Antenna Design Guide All Documentation 03/29/2019
Datasheet All Datasheet 03/29/2019
Product Brief - TiWi-uB2 All Product Brief 07/07/2021
3D Models CAD Downloads (8-11-2012)(450-0104) All Technical Drawings 03/29/2019
SCH/PCB Models CAD Downloads (12-3-2012)(450-0104) All Technical Drawings 03/29/2019
EM Board User Guide All Documentation 03/29/2019
EM Board CAD Download (12-3-2012) (450-0105) All Technical Drawings 03/29/2019
Bluetooth SIG Listing All Quality and Environmental 03/29/2019
Conflict Minerals Statement All Quality and Environmental 03/29/2019
EU RoHS (2011/65/EU) All Quality and Environmental 03/29/2019
FCC Bluetooth Grant All Quality and Environmental 03/29/2019
Product Change Notice (TiWi-uB2) All Quality and Environmental 03/29/2019
Product Life Cycle Policy All Quality and Environmental 03/29/2019
Reach Chemical Analysis All Quality and Environmental 03/29/2019
WEEE Statement All Quality and Environmental 03/29/2019
Regulatory Information - TiWi-uB2 All Certification 05/18/2021
EU Certifications - TiWi-uB2 All Certification 05/17/2021
FCC Certifications - TiWi-uB2 All Certification 05/17/2021
EOL Notice - TiWi-uB1 and TiWi-uB2 - Oct 2023 All Documentation 11/13/2023

FAQ

Can I develop my application directly on the TiWi-uB2 module?

The TiWi-uB2 module requires a host processor or microcontroller to be used in conjunction with the module. The upper layers of the Bluetooth or BLE stack runs on the host processor/microcontroller along with the application.

Which antennas are certified with the TiWi-uB2 module?

The TiWi-uB2 module is certified with the Ezurio (formerly Laird Connectivity) 2.4 GHz Dipole and 2.4 GHz Waterproof Dipole antennas, used in conjunction with any of our U.FL to Reverse Polarity SMA cables. Additionally the module is also certified with an off module Johanson Technology 2450AT43B100 chip antenna. Consult the Antenna Design Guide for details on implementing the TiWi-uB2 module into your design with one of the above certified antenna options.

Does the TiWi-uB2 module support both Classic Bluetooth and Bluetooth Low Energy (BLE)?

Yes the TiWi-uB2 module is a dual mode Bluetooth Smart Ready device, that supports both Classic and BLE.

What is the recommendation for washing BT/BLE modules?

We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.

What is the peak current for the TiWi-uB2 module?

While the datasheet lists the typical current draw of 47.1mA at 3.3 VDC, the max current is 70 to 75 mA at 3.3 VDC for the TiWi-uB2

My TiWi-uB2 eval board is returning ?Error connecting to BT device!!! Err:-199?

You may be experiencing a timeout exception because the module is not responding to a command. Please be aware that you must use flow control or CTS and RTS need to be connected together. Additionally, nShutdown needs to be driven high.

Can I use the Manufacturer's Specific AD record Data Type for Proprietary Data?

The Manufacturer's Specific Data Type is used for manufacturer specific data which can be proprietary data structures defined by the manufacturer and only identifiable by manufacturer's equipment/applications. To use the Manufacturer's Specific Data Type you need to have a Company Identifier as assigned by the BT SIG. You must be a registered member of the BT SIG and must apply for the company identifier using the process below (found at this link: https://www.bluetooth.com/specifications/assigned-numbers/company-ident…)   Application & Assignment Process Submit the following below to  Bluetooth Support : Company information (legal name of company) Name of company's primary contact (name and email) A statement that your company is currently a Bluetooth SIG member in good standing* Please allow five business days for your request to be fulfilled, and two business days from the time your request is fulfilled to view your Company Identifier on this page. *  ? BLUETOOTH Member in Good Standing ? shall mean any firm, corporation or other legal entity that has been admitted to membership in the BLUETOOTH SIG, whether a Promoter Member, Associate Member or Adopter Member, as defined in the organizational documents, that has fulfilled all of the requirements for membership, has paid and is current with payment of any and all membership fees, dues and assessments, and whose membership neither has been voluntarily or involuntarily suspended, terminated, or withdrawn from membership consistent with the lawful provisions of the organizational documents of the BLUETOOTH SIG.?

How can I test WLAN on the TiWi Series?

The TiWi-BLE can be tested a couple of ways. Either with the TiWi WLAN Eval Tool or in Linux with the following weblink to guide on how to do that. The customer needs to read through our product documentation before going to the following Ti page: http://processors.wiki.ti.com/index.php/WL127x_TX_Testing

Before we suggest using the Ti link above, the module must be calibrated, those steps and instructions are in the Documentation section on the product page.

 

 

What criteria should be confirmed when soldering Bluetooth modules?

The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.

Does Ezurio provide 3D files for modules?

Ezurio provides 3D files (STEP) files for most but not all of it's modules.  Based on the nature of the information in the files, in most cases Laird requires a login to access these files as well as layout files and software/firmware downloads.  As such, for most modules, the 3D files are found under the Software Downloads tab of the product page.  The page offers a credentials request link for customers who need credentials.  In most cases, the credentials are provided via return email within about 10 minutes. Please contact support if you have any additional questions or have any issues accessing our downloads.

Do we recommend conformal coating your modules?

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

How many reflows do you recommend for your modules?

We only recommend reflowing our modules once as it can damage the module and void the warranty.

What are the available CAD file formats?

Ezurio provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Ezurio uses ORCAD for schematics (Gerbers). 

What's the recommended process to clean modules?

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.  

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Talk to an Expert

Buy Now

Distributor Part In Stock Region Buy
Mouser 450-0104 194 North America Buy Now
Avnet 450-0104 0 North America Buy Now
Avnet 450-0104 0 North America Buy Now
DigiKey 450-0104 0 North America Buy Now
Future Electronics 450-0104 0 North America Buy Now
Symmetry Electronics 450-0104 0 North America Buy Now
Avnet 450-0104R 0 North America Buy Now
DigiKey 450-0104R 0 North America Buy Now
Symmetry Electronics 450-0104R 0 North America Buy Now
Avnet 450-0105 0 North America Buy Now
DigiKey 450-0105 0 North America Buy Now
Symmetry Electronics 450-0105 0 North America Buy Now

Distributors

Distributor Phone Number Region Website
Alpha Micro UK Only +44 1256-851770
EMEA Website
Arrow Electronics 1-855-326-4757
+44 2039 365486
APAC, North America, South America, EMEA Website
Avnet 1-480-643-2000
+44 1628 512900
APAC, North America, South America, EMEA Website
Braemac Australia, New Zealand, South East Asia +61 2 9550 6600
+64 9 477 2148
APAC Website
Cal-Chip Connect 1-215-942-8900
North America Website
DigiKey 1-800-344-4539
North America, South America, APAC, EMEA Website
EBV Elektronik EMEA Website
Farlink Technology China, Hong Kong +86 13266922199
APAC Website
Farnell 1-800-936-198
+44 3447 11 11 22
EMEA Website
Future Electronics 1-800-675-1619
1-514-428-8470
North America, South America, APAC, EMEA Website
Glyn +49-6126-590-0
EMEA Website
Jetronic China, Hong Kong and Taiwan 852-27636806 
APAC Website
Laird Connectivity 1-847-839-6925
+44 1628 858941
North America, South America, APAC, EMEA Website
M2M Germany +49-6081-587386-0
EMEA Website
Martinsson +46 8 7440300
EMEA Website
McCoy South East Asia +65 6515 2988
APAC Website
Mouser 1-800-346-6873
+44 1494 427500
North America, South America, APAC, EMEA Website
RS Components +852-2421-9898
+44 3457-201201
North America, South America, APAC, EMEA Website
Ryoyo Japan +81-3-3543-7711
APAC Website
Solsta UK Only +44 (0) 1527 830800
EMEA Website
Supreme Components International India, South East Asia +65 6848-1178
APAC Website
Symmetry Electronics 1-866-506-8829
North America Website
Tekdis Australia and New Zealand +61 3 8669 1210
APAC Website
Telsys +972 3 7657666
EMEA Website
WPG +44 1628 958460
EMEA Website