Powered by the very latest silicon technology, Laird’s 60 Series Wi-Fi + Bluetooth modules achieve the best possible connectivity and performance in any RF environment. With industry-leading software, broad OS support (Summit 60 only), and multiple form factors, Laird’s 60 Series offers flexibility to meet your needs. Based on the Marvell 88W8997 chipset, the 60 Series introduces 802.11ac, 2x2 MU-MIMO, Bluetooth 4.2 and Bluetooth 5 ready hardware on one lowpower module, delivering future-ready cutting edge technology for your product. Building on the security and robustness inherited from Laird’s expertise in its 40, 45, and 50 Series modules means ultra-high data rates, improved performance, and the most reliable wireless in crucial applications such as medical and industrial.
60 Series Product Family
Laird's 60 Series will be comprised of two classes of modules to give you flexibility in your wireless design:
60-SIPT (SIP Module)
60-2230C (USB of SDIO Module)
Product samples and dev kits are planned for the first quarter of 2017
BRING WI-FI + BLUETOOTH TO EVEN MORE DEVICES
60 Series modules are supported on Linux® and Android™ (Summit 60 only)
REDUCED POWER CONSUMPTION
28nm process technology results in significant power savings over competitive radios
CONNECT AT ULTRA-HIGH DATA RATES
With 802.11ac and 2x2 MU-MIMO, 60 Series can achieve data rates up to 866 Mbps
ALWAYS CONNECTED, EVEN IN THE HARSHEST CONDITIONS
802.11r + CCKM (Summit 60 only) support for rapid roaming and 2x2 MU-MIMO for improved performance and reliability
MULTIPLE FORM FACTORS TO SUIT DIVERSE NEEDS
Available as a SiP or M.2 (USB or SDIO) form factors
ROBUST SECURITY FOR ENTERPRISE DEMANDS
Full list of security standards and EAP types (Summit 60 only)
BROAD CERTIFICATION AND INTERNATIONAL APPROVALS
Certifications for FCC, IC, CE, KCC, Giteki (pending), RCM (pending).
PERSONAL SUPPORT FROM DESIGN TO MANUFACTURE
Industry-recognized integration and support organization dedicated to reducing your time to market
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