Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

DAT-065-24-02-00-00
DAT-065-24-02-00-00

The Tunnel Series Direct-to-Air thermoelectric assembly is a thermoelectric based air...

Cooling Capacity
64 Watts
Input Voltage
24 VDC
Dimensions
65.00 x 86.00 x 180.00 mm
DAT-065-12-02-00-00
DAT-065-12-02-00-00

The Tunnel Series Direct-to-Air thermoelectric assembly is a thermoelectric based air...

Cooling Capacity
65 Watts
Input Voltage
12 VDC
Dimensions
65.00 x 86.00 x 180.00 mm
DAT-105-12-02-00-00
DAT-105-12-02-00-00

The Tunnel Series Direct-to-Air thermoelectric assembly is a thermoelectric based air...

Cooling Capacity
103 Watts
Input Voltage
12 VDC
Dimensions
83.00 x 98.00 x 248.00 mm
DAT-105-24-02-00-00
DAT-105-24-02-00-00

The Tunnel Series Direct-to-Air thermoelectric assembly is a thermoelectric based air...

Cooling Capacity
106 Watts
Input Voltage
24 VDC
Dimensions
83.00 x 98.00 x 248.00 mm
Tflex HD90000
Tflex HD90000

Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™...

Thickness Min (mm)
5
Thickness Max (mm)
1
Thermal Conductivity
7.5
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Slim TIM 10000
Slim TIM 10000

Slim TIMTM 10000 is a non-silicone, high performance thermal interface material designed...

Thermal Conductivity
5.5
Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tflex HD400
Tflex HD400

Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of...

Tflex P100
Tflex P100

Laird Tflex® P100 is a soft and compliant gap filler with an integrated Tgard liner and...

Tflex P300
Tflex P300

Laird Tflex® P300 is a soft and compliant gap filler with an integrated polyimide liner...

Tflex 50000
Tflex 50000

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 50000 is a compliant elastomer...

Thermal Conductivity
2.7
Tflex HD300
Tflex HD300

Laird Tflex HD300 is a 2.7 W/mK gap filling material in our high deflection line of...

Thermal Conductivity
2.7
PC12,139,F1,3550,TA,W6
PC12,139,F1,3550,TA,W6

The PowerCycling Series is a thermoelectric module (TEM) designed for thermal cycling...

Dimensions
35.00 x 3.00 x 50.00 mm
Product Line
Power Cycling Series
Tlam SS HTD03
Tlam SS HTD03

Tlam SS HTD03 is a high temperature thermally conductive Printed Circuit Board (PCB)...

Thermal Conductivity
2.2
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