Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

Tgon 9000 Series Graphite Sheets
Tgon 9000 Series Graphite Sheets

HIGH THERMAL CONDUCTIVE GRAPHITE SHEET Tgon™ 9000 is a synthetic graphite thermal...

Thickness Min (mm)
0.017
Thickness Max (mm)
0.1
AA-150-24-44-00-XX
AA-150-24-44-00-XX

The AA Outdoor Cooler Series is a ruggedized Air-to-Air thermoelectric assembly (TEA)...

Cooling Capacity
149 Watts
Input Voltage
24 VDC
Dimensions
152.00 x 183.00 x 300.00 mm
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tlam SS HTD06
Tlam SS HTD06

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
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