Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

Slim TIM 10000
Slim TIM 10000

Slim TIMTM 10000 is a non-silicone, high performance thermal interface material designed...

Thermal Conductivity
5.5
Tflex 50000
Tflex 50000

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 50000 is a compliant elastomer...

Thermal Conductivity
2.7
Tflex 300TG
Tflex 300TG

The high rate of compliancy of Tflex 300TG allows the material to “totally blanket” the...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tflex 300
Tflex 300

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tflex 700
Tflex 700

Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
5
Tflex SF800
Tflex SF800

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-...

Thickness Min (mm)
0.05
Thickness Max (mm)
4
Thermal Conductivity
7.8
Tputty 502
Tputty 502

Creates Compression Of Interface Material Tputty 502 is the best material for...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
3
Tflex SF600
Tflex SF600

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high...

Thickness Min (mm)
0.25
Thickness Max (mm)
3.5
Thermal Conductivity
3
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