Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tpcm 580
Tpcm 580

For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance...

Thickness Min (mm)
0.07
Thickness Max (mm)
0.4
Thermal Conductivity
3.8
Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tgrease 1500
Tgrease 1500

Solves Overheating And Reliability Issues Tgrease 1500 is environmentally safe silicone-...

Thermal Conductivity
1.2
Tpcm HP105
Tpcm HP105

For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance...

Thickness Min (mm)
0.125
Thickness Max (mm)
0.125
Thermal Conductivity
0.73
TPCM FSF 52
TPCM FSF 52

Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...

Thermal Conductivity
0.9
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
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