Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tflex 50000
Tflex 50000

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 50000 is a compliant elastomer...

Thermal Conductivity
2.7
Tlam SS HTD03
Tlam SS HTD03

Tlam SS HTD03 is a high temperature thermally conductive Printed Circuit Board (PCB)...

Thermal Conductivity
2.2
Tflex UT20000
Tflex UT20000

Ultra-thin gap filler offering great thermal performance and handling Tflex™ UT20000 is a...

Tflex 300TG
Tflex 300TG

The high rate of compliancy of Tflex 300TG allows the material to “totally blanket” the...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
TFlex HR600
TFlex HR600

Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
3
Tflex 700
Tflex 700

Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
5
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 06
Tlam SS 1KA 06

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 08
Tlam SS 1KA 08

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tflex HR400
Tflex HR400

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant...

Thickness Min (mm)
0.5
Thickness Max (mm)
10.2
Thermal Conductivity
1.8
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
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