Thermal Management

As an industry-leading thermoelectric leader, Laird designs and manufactures some of the world’s highest-rated, thermally conductive materials, thermoelectric modules, thermoelectric assemblies, temperature controllers and liquid cooling systems for global applications including telecom, medical, automotive, consumer, instrumentation, military and others.

Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tflex 300TG
Tflex 300TG

The high rate of compliancy of Tflex 300TG allows the material to “totally blanket” the...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tgard 300
Tgard 300

Tgard 300 is a medium thermal performance insulator pad consisting of a ceramic high...

Thickness Min (mm)
0.23
Thickness Max (mm)
0.23
TFlex HR600
TFlex HR600

Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
3
Tflex 300
Tflex 300

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tflex SF800
Tflex SF800

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-...

Thickness Min (mm)
0.05
Thickness Max (mm)
4
Thermal Conductivity
7.8
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 06
Tlam SS 1KA 06

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 08
Tlam SS 1KA 08

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tputty 502
Tputty 502

Creates Compression Of Interface Material Tputty 502 is the best material for...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
3
Tgon 800 Thermal Interface Material
Tgon 800 Thermal Interface Material

High-Performance, Cost Effective Thermal Interface Material Used where electrical...

Thickness Min (mm)
0.125
Thickness Max (mm)
0.5
Thermal Conductivity
5
Tgard 200
Tgard 200

The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride...

Thickness Min (mm)
0.254
Thickness Max (mm)
0.762
Thermal Conductivity
5
Tflex HR400
Tflex HR400

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant...

Thickness Min (mm)
0.5
Thickness Max (mm)
10.2
Thermal Conductivity
1.8
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