Thermal Materials

Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Sort by

Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tgard 200
Tgard 200

The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride...

Thickness Min (mm)
0.254
Thickness Max (mm)
0.762
Thermal Conductivity
5
Tflex 200V0
Tflex 200V0

Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.1
Tpli 200
Tpli 200

Exceptionally Soft, Highly Compressible Gap Filler Tpli 200 is a premium gap filler. A...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
6
Tgard 300
Tgard 300

Tgard 300 is a medium thermal performance insulator pad consisting of a ceramic high...

Thickness Min (mm)
0.23
Thickness Max (mm)
0.23
Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tlam SS 1KA 06
Tlam SS 1KA 06

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 08
Tlam SS 1KA 08

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tgrease 980
Tgrease 980

Environmentally Friendly Thermally Conductive Grease Tgrease™ 980 is a silicone-based...

Thermal Conductivity
3.1
Tgard K52
Tgard K52

High Thermal and Dielectric Performance Insulator Pad Tgard K52 is a high thermal and...

Thickness Min (mm)
0.05
Thickness Max (mm)
0.1
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Hide Me

Copyright © 2018 Laird Technologies

Media Contact Information

For Investor media / PR enquiries, please contact Reg Hoare or John Olsen at:

MHP Communications
60 Great Portland Street
London, England
W1W 7RT

Tel: +44 (0)20 3128 8100
Fax: +44 (0)20 3128 8171

Laird PLC UK
Peter Jenkins
Director of Communications
Laird PLC
100 Pall Mall, London, SW1Y 5NQ, United Kingdom

Office: +44 207 468 4074
Mobile: +44 778 858 4269

For Technology media / PR inquiries, please contact Tom Pagano at:

Laird USA
16401 Swingley Ridge Road
Suite 700
Chesterfield, MO 63017

Tel: +1-314-602-7549
Fax: +1-636-898-6100

Investors and Financial Information
For investors, financial analysts, and financial media, please visit Investor Relations