Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Current Category: Thermal Materials

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Tgard 300
Tgard 300

Tgard 300 is a medium thermal performance insulator pad consisting of a ceramic high...

Thickness Min (mm)
0.23
Thickness Max (mm)
0.23
Tpli 200
Tpli 200

Exceptionally Soft, Highly Compressible Gap Filler Tpli 200 is a premium gap filler. A...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
6
Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tgard 200
Tgard 200

The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride...

Thickness Min (mm)
0.254
Thickness Max (mm)
0.762
Thermal Conductivity
5
Tflex 200V0
Tflex 200V0

Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.1
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 580
Tpcm 580

For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance...

Thickness Min (mm)
0.07
Thickness Max (mm)
0.4
Thermal Conductivity
3.8
Tpcm AL-52
Tpcm AL-52

Tpcm Al-52 is a thermally conductive phase change material coated on both side of...

Tflex 200TV0
Tflex 200TV0

Tflex 200T V0 is a specially formulated thin gap filler thermal interface material...

Thickness Min (mm)
0.2
Thickness Max (mm)
0.38
Thermal Conductivity
1.5
Tflex 300TG
Tflex 300TG

The high rate of compliancy of Tflex 300TG allows the material to “totally blanket” the...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tgard 400
Tgard 400

Electrically insulating, thermally conductive material Tgard 400 is a medium thermal...

Thickness Min (mm)
0.23
Thickness Max (mm)
0.23

 

Learn how to beat the heat at
“Thermal Management 101”

Join Laird Staff Scientist Kaley Cancar for insights on the growing array of thermal compliance issues now facing electronic systems designers. Providing enough cooling power is only a first step. An ever-worsening challenge is transferring growing heat loads from hot components into heat sinks and other cooling hardware. In this recorded event, Kaley will trace the evolution of high-performance thermal interface materials (TIMs) and share steps electronic manufacturers are taking to create precision-designed TIMs.