Dispensable

Tputty 508
Tputty 508

Laird Tputty™ 508 is a single part dispensable material designed with automation and...

Thermal Conductivity
3.7
Flow Rate
50
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
Hide Me