Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Current Category: Thermal Gap Fillers

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Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tflex HD90000
Tflex HD90000

Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™...

Thickness Min (mm)
5
Thickness Max (mm)
1
Thermal Conductivity
7.5
Tflex 300
Tflex 300

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tflex HD700
Tflex HD700

Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus...

Thermal Conductivity
5
Tflex HD300
Tflex HD300

Laird Tflex HD300 is a 2.7 W/mK gap filling material in our high deflection line of...

Thermal Conductivity
2.7
Tflex SF600
Tflex SF600

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high...

Thickness Min (mm)
0.25
Thickness Max (mm)
3.5
Thermal Conductivity
3
Tflex SF800
Tflex SF800

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-...

Thickness Min (mm)
0.05
Thickness Max (mm)
4
Thermal Conductivity
7.8
Tpli 200
Tpli 200

Exceptionally Soft, Highly Compressible Gap Filler Tpli 200 is a premium gap filler. A...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
6
Tflex 600
Tflex 600

EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER Tflex 600 is an exceptionally soft,...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
3
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tflex HR400
Tflex HR400

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant...

Thickness Min (mm)
0.5
Thickness Max (mm)
10.2
Thermal Conductivity
1.8
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tflex 200V0
Tflex 200V0

Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.1
Tputty 502
Tputty 502

Creates Compression Of Interface Material Tputty 502 is the best material for...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
3