LairdTech
Thermal Interface Solutions
Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
Download our Thermal Interface Solutions brochure.
Tmate 2900
For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...
Tpcm 780
Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal...
- Thickness Min (mm)
- 0.203
- Thickness Max (mm)
- 0.635
- Thermal Conductivity
- 5.4
TPCM FSF 52
Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...
- Thermal Conductivity
- 0.9
Tpcm HP105
For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance...
- Thickness Min (mm)
- 0.125
- Thickness Max (mm)
- 0.125
- Thermal Conductivity
- 0.73
Tpcm 900
Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...
- Thickness Min (mm)
- 0.25
- Thickness Max (mm)
- 0.5
- Thermal Conductivity
- 2.23
Tpcm 580
For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance...
- Thickness Min (mm)
- 0.07
- Thickness Max (mm)
- 0.4
- Thermal Conductivity
- 3.8
Tpcm 200SP
TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...