Phase Change Materials

Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tpcm 580
Tpcm 580

For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance...

Thickness Min (mm)
0.07
Thickness Max (mm)
0.4
Thermal Conductivity
3.8
Tpcm AL-52
Tpcm AL-52

Tpcm Al-52 is a thermally conductive phase change material coated on both side of...

Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tpcm HP105
Tpcm HP105

For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance...

Thickness Min (mm)
0.125
Thickness Max (mm)
0.125
Thermal Conductivity
0.73
TPCM FSF 52
TPCM FSF 52

Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...

Thermal Conductivity
0.9
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 780
Tpcm 780

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal...

Thickness Min (mm)
0.203
Thickness Max (mm)
0.635
Thermal Conductivity
5.4
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