Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Current Category: Phase Change Materials

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Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tpcm 580
Tpcm 580

For Exceptionally Low Thermal Resistance The Tpcm 580 Series is a high-performance...

Thickness Min (mm)
0.07
Thickness Max (mm)
0.4
Thermal Conductivity
3.8
Tpcm AL-52
Tpcm AL-52

Tpcm Al-52 is a thermally conductive phase change material coated on both side of...

Tpcm HP105
Tpcm HP105

For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance...

Thickness Min (mm)
0.125
Thickness Max (mm)
0.125
Thermal Conductivity
0.73
Tpcm 780
Tpcm 780

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal...

Thickness Min (mm)
0.203
Thickness Max (mm)
0.635
Thermal Conductivity
5.4
TPCM FSF 52
TPCM FSF 52

Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...

Thermal Conductivity
0.9