Thermal Materials

Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Tputty 508
Tputty 508

Laird Tputty™ 508 is a single part dispensable material designed with automation and...

Thermal Conductivity
3.7
Flow Rate
50
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tflex HD90000
Tflex HD90000

Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™...

Thickness Min (mm)
5
Thickness Max (mm)
1
Thermal Conductivity
7.5
Slim TIM 10000
Slim TIM 10000

Slim TIMTM 10000 is a non-silicone, high performance thermal interface material designed...

Thermal Conductivity
5.5
Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tflex HD400
Tflex HD400

Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tflex P100
Tflex P100

Laird Tflex® P100 is a soft and compliant gap filler with an integrated Tgard liner and...

Tflex P300
Tflex P300

Laird Tflex® P300 is a soft and compliant gap filler with an integrated polyimide liner...

Tflex HD700
Tflex HD700

Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus...

Thermal Conductivity
5
Tflex 50000
Tflex 50000

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 50000 is a compliant elastomer...

Thermal Conductivity
2.7
Tflex HD300
Tflex HD300

Laird Tflex HD300 is a 2.7 W/mK gap filling material in our high deflection line of...

Thermal Conductivity
2.7
Tlam SS HTD03
Tlam SS HTD03

Tlam SS HTD03 is a high temperature thermally conductive Printed Circuit Board (PCB)...

Thermal Conductivity
2.2
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