Thermal Materials

Tputty 508
Tputty 508

Laird Tputty™ 508 is a single part dispensable material designed with automation and...

Thermal Conductivity
3.7
Flow Rate
50
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tputty 504
Tputty 504

Soft Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for...

Thermal Conductivity
1.8
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tflex HR400
Tflex HR400

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant...

Thickness Min (mm)
0.5
Thickness Max (mm)
10.2
Thermal Conductivity
1.8
Tflex SF600
Tflex SF600

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high...

Thickness Min (mm)
0.25
Thickness Max (mm)
3.5
Thermal Conductivity
3
Tgard K52
Tgard K52

High Thermal and Dielectric Performance Insulator Pad Tgard K52 is a high thermal and...

Thickness Min (mm)
0.05
Thickness Max (mm)
0.1
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tlam SS HTD06
Tlam SS HTD06

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 780
Tpcm 780

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal...

Thickness Min (mm)
0.203
Thickness Max (mm)
0.635
Thermal Conductivity
5.4
TPCM FSF 52
TPCM FSF 52

Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...

Thermal Conductivity
0.9
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Hide Me