Thermal Materials

Tputty 508
Tputty 508

Laird Tputty™ 508 is a single part dispensable material designed with automation and...

Thermal Conductivity
3.7
Flow Rate
50
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tgon 9000 Series Graphite Sheets
Tgon 9000 Series Graphite Sheets

HIGH THERMAL CONDUCTIVE GRAPHITE SHEET Tgon™ 9000 is a synthetic graphite thermal...

Thickness Min (mm)
0.017
Thickness Max (mm)
0.1
Tputty 504
Tputty 504

Soft Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for...

Thermal Conductivity
1.8
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tlam SS HTD06
Tlam SS HTD06

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tpcm 780
Tpcm 780

Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal...

Thickness Min (mm)
0.203
Thickness Max (mm)
0.635
Thermal Conductivity
5.4
TPCM FSF 52
TPCM FSF 52

Tpcm FSF-52 is a free standing film. It contains no substrate. At temperatures greater...

Thermal Conductivity
0.9
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
Tflex HR400
Tflex HR400

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant...

Thickness Min (mm)
0.5
Thickness Max (mm)
10.2
Thermal Conductivity
1.8
Tflex SF600
Tflex SF600

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high...

Thickness Min (mm)
0.25
Thickness Max (mm)
3.5
Thermal Conductivity
3
Tgard K52
Tgard K52

High Thermal and Dielectric Performance Insulator Pad Tgard K52 is a high thermal and...

Thickness Min (mm)
0.05
Thickness Max (mm)
0.1
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