Thermal Materials

Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Tpcm 580SP
Tpcm 580SP

TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable...

Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tpcm 750
Tpcm 750

TpcmTM 750 Series is a high-performance thermal phase change material designed to meet...

Tgard 300
Tgard 300

Tgard 300 is a medium thermal performance insulator pad consisting of a ceramic high...

Thickness Min (mm)
0.23
Thickness Max (mm)
0.23
Tpli 200
Tpli 200

Exceptionally Soft, Highly Compressible Gap Filler Tpli 200 is a premium gap filler. A...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
6
Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tflex 200V0
Tflex 200V0

Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.1
Tgard 200
Tgard 200

The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride...

Thickness Min (mm)
0.254
Thickness Max (mm)
0.762
Thermal Conductivity
5
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

Tflex HD700
Tflex HD700

Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus...

Thermal Conductivity
5
Tflex HD90000
Tflex HD90000

Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™...

Thickness Min (mm)
5
Thickness Max (mm)
1
Thermal Conductivity
7.5
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Slim TIM 10000
Slim TIM 10000

Slim TIMTM 10000 is a non-silicone, high performance thermal interface material designed...

Thermal Conductivity
5.5
Tpcm 200SP
Tpcm 200SP

TpcmTM 200SP is a silicone free, thermal phase change material (PCM) designed to meet the...

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