Thermal Interface Solutions

Laird designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

Download our Thermal Interface Solutions brochure.

Current Category: Thermal Materials

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Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tflex HD90000
Tflex HD90000

Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™...

Thickness Min (mm)
5
Thickness Max (mm)
1
Thermal Conductivity
7.5
Tflex 300
Tflex 300

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
1.2
Tflex HD700
Tflex HD700

Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus...

Thermal Conductivity
5
Tflex HD300
Tflex HD300

Laird Tflex HD300 is a 2.7 W/mK gap filling material in our high deflection line of...

Thermal Conductivity
2.7
Tflex SF600
Tflex SF600

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high...

Thickness Min (mm)
0.25
Thickness Max (mm)
3.5
Thermal Conductivity
3
Tpli 200
Tpli 200

Exceptionally Soft, Highly Compressible Gap Filler Tpli 200 is a premium gap filler. A...

Thickness Min (mm)
0.25
Thickness Max (mm)
5
Thermal Conductivity
6
Tflex SF800
Tflex SF800

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-...

Thickness Min (mm)
0.05
Thickness Max (mm)
4
Thermal Conductivity
7.8
Tflex 600
Tflex 600

EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER Tflex 600 is an exceptionally soft,...

Thickness Min (mm)
0.5
Thickness Max (mm)
5
Thermal Conductivity
3
Tputty 403
Tputty 403

Soft And Low Abrasion Gap Filler Tputty 403 is a single-part silicone-based thermal gap...

Thermal Conductivity
2.3
Flow Rate
29
Min Bondline Thickness
0.005
Tgard 100
Tgard 100

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron...

Tgard K52
Tgard K52

High Thermal and Dielectric Performance Insulator Pad Tgard K52 is a high thermal and...

Thickness Min (mm)
0.05
Thickness Max (mm)
0.1
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tlam SS HTD06
Tlam SS HTD06

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

 

Learn how to beat the heat at
“Thermal Management 101”

Join Laird Staff Scientist Kaley Cancar for insights on the growing array of thermal compliance issues now facing electronic systems designers. Providing enough cooling power is only a first step. An ever-worsening challenge is transferring growing heat loads from hot components into heat sinks and other cooling hardware. In this recorded event, Kaley will trace the evolution of high-performance thermal interface materials (TIMs) and share steps electronic manufacturers are taking to create precision-designed TIMs.