Thermal Materials

Tputty 508
Tputty 508

Laird Tputty™ 508 is a single part dispensable material designed with automation and...

Thermal Conductivity
3.7
Flow Rate
50
Tputty 607
Tputty 607

Laird Tputty™ 607 is a high thermally conductive single part dispensable material...

Thermal Conductivity
6.4
Flow Rate
60
Tpcm 900
Tpcm 900

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°...

Thickness Min (mm)
0.25
Thickness Max (mm)
0.5
Thermal Conductivity
2.23
Tflex SF800
Tflex SF800

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-...

Thickness Min (mm)
0.05
Thickness Max (mm)
4
Thermal Conductivity
7.8
Tgard TNC-4
Tgard TNC-4

Low Cost, Medium Performance Insulator Material In Automotive Electronics Applications...

Thickness Min (mm)
0.127
Thickness Max (mm)
0.127
Tlam SS 1KA 04
Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 06
Tlam SS 1KA 06

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tlam SS 1KA 08
Tlam SS 1KA 08

Thermally Conductive Printed Circuit Board Substrate Tlam SS 1KA is a thermally...

Thermal Conductivity
3
Tgrease 980
Tgrease 980

Environmentally Friendly Thermally Conductive Grease Tgrease™ 980 is a silicone-based...

Thermal Conductivity
3.1
Tputty 504
Tputty 504

Soft Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for...

Thermal Conductivity
1.8
Tputty 506
Tputty 506

Soft Silicone Putty Tputty 506 is a soft single part silicone putty thermal gap filler in...

Thermal Conductivity
3.5
Flow Rate
17.2
Min Bondline Thickness
0.1
Tflex CR200
Tflex CR200

TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part silicone-based thermal gap...

Thermal Conductivity
2
Flow Rate
170
Min Bondline Thickness
0.025
Tlam SS HTD04
Tlam SS HTD04

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tlam SS HTD06
Tlam SS HTD06

Thermally Conductive Printed Circuit Board Substrate Tlam SS HTD is a thermally...

Thermal Conductivity
2.2
Tmate 2900
Tmate 2900

For Exceptionally Low Thermal Resistance The Tmate 2900 Series is a reusable phase change...

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