Ringing the changes for EMI, thermal management and antenna solutions in a fast changing telecommunications environment.

The emergence of high-speed wired networks, 3G, 4G, and “always on” broadband services has placed tremendous demands on current and future telecommunications technologies and services, and the needs of telecommunication product manufacturers. Helping to support these needs with a range of innovative EMI, thermal management and wireless communication/antenna solutions is Laird.

As base stations and switching gear are deployed in more remote regions, the environmental demands on equipment have increased.  Laird is the world leader in the advanced thermal solutions used on base stations and back-up power, providing thermoelectric assemblies to cool electronics in hot environments.  Indeed in many cases, our thermal interface materials (TIMs) have become the industry standard for effective heat removal.

In addition to board-level shielding (BLS), Fabric-over-Foam (FoF) and metal EMI gaskets, we provide advanced Form-in-Place (FIP) conductive elastomers that are dispensed directly onto multi-compartment housings commonly used in telecom electronics.  Materials for FIP are developed by our in-house R&D and customer engineering teams and produced in our own factories, ensuring consistent performance of equipment operating in the field for 10 years or more.  We can formulate elastomers and conductive fillers to ensure material compatibility, environmental and EMI sealing, and long-term reliability.

Both 3G and 4G deployments have changed the benchmark for base station antenna performance, requiring precision control of beam shape, sector widths, gain and other key electrical parameters.  Laird uses proprietary Artificial Intelligence (AI) design tools to optimize antennas to a level of performance that other providers cannot achieve.  Our WiMAX and LTE sector antennas boast superior azimuth gain control, enabling channel reuse in adjacent sectors and thus much better spectrum use. We can also design custom solutions as required.