T-flex™ 200 V0
Commercial Grade Elastic Gap Fillers
The T-flex™ 200 V0 Series is a very soft, free standing gap filler that is more conformable than most gap fillers. T-flex™ 200 V0 combines good thermal conductivity of 1.1 Wm/K with high conformability to produce low thermal resistance. The alumina filler allows T-flex™ 200 V0 to remain a cost effective solution where moderate thermal performance is acceptable. T-flex™ 200 V0 is naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance. T-flex™ 200 V0 is electrically insulating, stable from -40°C to 160°C and meets UL 94V0 rating.
Features and Benefits:
- Soft and conformable for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
- Available in 20 thicknesses from 0.010" (0.20 mm) to 0.200" (5.00 mm)
Applications:
- Cooling multiple components to the chassis or frame
- Plasma supply panels
- High speed mass storage drives
- RDRAM memory modules
- Heat pipe thermal solutions
- Automotive engine control units
- Wireless communication hardware
T-flex™ 200 V0 Series Data Tables
- T-flex™ 200 V0 220 - 240
- T-flex™ 200 V0 250 - 280
- T-flex™ 200 V0 290 - 2120
- T-flex™ 200 V0 2130 - 2160
- T-flex™ 200 V0 2170 - 2200
- T-flex™ 200 V0 Testing Methods
- Product Options
- Product Testing Procedures
Specification Sheets & Brochures



