Thermally Enhanced Board Level Shields (T-BLS)
The need to add innovative cooling techniques to electronics
components is increasing as more powerful components and increased
package densities are added to applications.
Air, by nature, acts as a heat insulator (only 0.03W/mK thermal
conductivity) so air gaps must be removed to allow heat to
transfer from the electronics board or chip. Removing air gaps
significantly reduces the thermal load on components.
To address applications where heat needs to be removed and where
board level shielding is also required; Laird Technologies is
incorporating thermal interface materials with board level shields.
Adding a thermal interface gap filler material that is soft, compliant
and has high thermal conductivity between the electronic component
and board level shield cools the component by removing the air gap
producing a more reliable electronic system.
Features and Benefits
- Provides excellent emi shielding and thermal management
in a single part assembly solution - Uses Laird Technologies T-flex™ 600 Series thermal gap filler which
an is an exceptionally soft, highly compressible gap filler material
with high thermal conductivity and low thermal impedance/resistance - Provides electrical isolation of board level components
- Custom designs and shapes are available
- Other thermal interface materials are available depending on
application and specifications - RoHS compliant
Applications
- Hand-held wireless electronic devices including PDAs
and mobile phones - Small consumer electronics products such as portable DVD players
- Notebook computers
Product Specification Sheet
More Information
