T-putty™ 504
Dispensable Silicone Gel Thermal Gap Filler
T-putty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.
T-putty 504 is soft and compliant transferring little to no pressure between interfaces.
Because T-putty 504 has a higher viscosity than grease, it eliminates the bleed, separation and pump-out usually associated with grease. Bond line variances can also be more easily controlled with T-putty 504 than with traditional thermal pads.
T-putty 504 can be applied like grease and is easily dispensable from a wide range of commercially available equipment including screen print, syringe and automation equipment.
Applications:
- Flip chart microprocessors
- PPGA's
- MicroBGA's
- BGA's
- DSP chips
- Graphic accelerator chips
- Other high wattage electronic components
T-putty 504 Silicone Gel Gap Filler Data Table
Click icon to access product data table
Specification Sheets & Brochures
- T-putty 504 Spec Sheet
- T-putty 504 RoHS Test Report
- Gap Filler Product Line Spec Sheet
- Corporate Overview brochure
- T-putty 504 MSDS Report
