T-putty™ 502 Series
Ultra Compressible Thermal Gap Filler with 3.0 W/mK
T-putty™ 502 Series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness.
T-putty 502 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, T-putty 502 has a high thermal conductivity that results in very low thermal resistance.
T-putty 502 is naturally tacky and requires no further adhesive coating, which would inhibit thermal performance. T-putty 502 has a hardness of 5 (Shore OO), is electrically insulating, and is stable from -45°C to 200°C.
Features and Benefits:
- Soft and ultra high compressibility for low stress applications
- 3.0 W/mK thermal conductivity
- Available in sheets (from 0.020” to 0.200” thick) and in bulk
- Naturally tacky needing no further adhesive coating
Applications:
- Cooling multiple components to the chassis or frame
- Entire large panel printed circuit board cooling
- Semiconductor automated test equipment
- Any high compression low stress application
T-putty 502 Series Data Tables
- T-putty 502 Series .02 - .05
- T-putty 502 Series .06 - .09
- T-putty 502 Series .10 - .13
- T-putty 502 Series .14 - .17
- T-putty 502 Series .18 - .20 and Test Methods
- Product Options
- Product Testing Procedures
