Thermal Phase Change Materials
Thermal phase change materials are solid pads at room temperature that melt at operating temperatures from intimate contact on the mating surfaces to produce low thermal resistance. Laird Technologies offers a broad range of phase change materials (PCM) for a variety of applications.
Benefits and Features
- Supplied on rolls with top tabbed liners for easy application; clearly superior to thermal grease application
- Provides superior surface wetting, minimum bondlines thickness and actively expels entrapped air, all leading to maximum thermal performance of any available phase change material
- Designed to provide stable and reliable performance
Applications
- Microprocessors
- Chipsets
- Graphics processing units
- Custom ASICS
- Power components and modules
- Memory Modules
Products
- T-pcm 580 Series - High Performance Phase Change Material
- T-pcm 580S Series - High Performance Phase Change Material
- T-pcm™ 900 Series - Naturally Tacky Phase Change Material for Easy Application
- T-pcm™ FSF-52 - Thixotropic, Low Thermal Resistance, Waxed Based Phase Change Material
- T-pcm™ HP105 - Low Thermal Resistance, Naturally Tacky Phase Change Material
- T-mate™ 2900 Series - Phase Change Material Coated Foil Providing a Reusable Thermal Interface Material
