T-pcm™ HP105
High Performance, Naturally Tacky Phase Change Material
T-pcm™ HP105 is a high performance phase change product with an exceptionally low thermal resistance. T-pcm™ HP105 is a flexible solid at room temperature and freestanding without any reinforcing layer which would reduce thermal performance. T-pcm™ HP105 is naturally tacky providing for easy application. No additional adhesive is required, which would also reduce thermal performance.
At 50°C, T-pcm™ HP105 begins to soften and flow filling the microscopic irregularities of both the thermal solution and the components surfaces, thereby reducing thermal interface resistance.
T-pcm™ HP105 shows no thermal performance degradation after thermal cycling at -20°C to 80°C for over 2500 cycles. T-pcm™ HP105 uses a non-wax matrix whereby the material softens and does not fully change state, resulting in minimal migration (pump out).
T-pcm™ HP105 is supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individual die cut parts can also be supplied.
Features and Benefits
- 0.02ºC-in²/W thermal resistance
- Naturally tacky; extremely easy to use
- Stable and reliable
Applications
- Microprocessors
- Chipsets
- Graphics processing units
- Custom ASICS
- Power components and modules
T-pcm HP105 Data Table
Specification Sheets and Brochures
- T-pcm™ HP105 Specification Sheet
- T-pcm™ HP105 Product Options
- T-pcm™ HP105 Thermal Cycling Testing
- Product Testing Methods
- T-pcm™ HP105 RoHS Test Report
- T-pcm™ HP105 Instructions for Use
- T-pcm™ HP105 MSDS Sheet
