T-pcm™ FSF-52
Thixotropic, Low Thermal Resistance, Wax Based Phase Change Material
T-pcm™ FSF-52, formerly known as Thermaphase®, is a wax-based self supporting film. It contains no substrate. At temperatures greater than 52 °C, T-pcm™ FSF-52 changes into a molten state, wets the heat sink and component surfaces to create a very thin, low thermal resistance interface.
T-pcm™ FSF-52 is thixotropic and doesn't flow from the interface.
T-pcm™ FSF-52 is available as individual die cut parts, kiss cut parts on rolls or sheets and uncut rolls. T-pcm™ FSF-52 has a thickness of 0.005” (0.125mm) and available with or without adhesive.
Applications
- Microprocessors
- Chipsets
- Graphics processing units
- Custom ASICS
- Power components and modules
Technical Specifications
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Specification Sheets and Brochures
Thermaphase® is a registered trademark of Laird Technologies,
Thermal Products Division
U.S. Patent Numbers 5,930,893 and 6,286,212
