T-pcm™ 580 Series
High Performance Thermal Phase Change Materials
T-pcm™ 583 and 585 are high performing thermal phase change materials engineered to meet the thermal, reliability and price requirements of high end thermal applications. These high performance thermal phase change materials are inherently tacky, flexible and easy to use.
T-pcm™ 583 and 585 begins to soften and flow, filling the microscopic irregularities of the components it contacts at temperatures above its transition temperature of 50°C (122°F). This results in an interface that has minimal thermal contact resistance. Due to the gradual change in viscosity (softening), T-pcm™ 583 and 585 minimizes migration (pump out).
Features and Benefits
- Low total thermal resistance (0.013°C-in²/W at 50 psi)
- Inherently tacky and easy to use - No adhesive required
- High reliability
- Meets all environmental requirements; including RoHS
- Provides excellent value for price/performance point
- Can be supplied as cut parts in strips and rolls with top tabbed liner for easy application
- Top tabbed liner can be removed immediately or removed during assembly
Applications
- Microprocessors
- Chipsets
- Graphic processing chips
- Custom ASICS
Technical Specifications

Click here to access technical product specifications
Specification Sheets and Brochures




