T-mate™ 2900 Series
Reusable Thermal Phase Change Material
T-mate™ 2900 Series is a reusable phase change material designed for easy reworkability. The T-mate™ 2900 Series is comprised of an unique malleable metal foil and a high performance phase change material. At 50°C, the T-mate™ 2900 Series begins to soften and flow, filling the microscopic irregularities of the thermal solution, thus reducing thermal resistance. Due to the foil, the interface can be separated many times without needing to replace the pad. This is a benefit when multiple tests are required with the same thermal solution.
T-mate™ 2900 Series shows no thermal performance degradation after 1,000 hours @ 130°C nor after 500 cycles (-25°C to 125°C). The phase change material softens and does not fully change state resulting in minimal migration (pump out) at operating temperatures.
T-mate™ 2900 Series is available in thicknesses of 0.005", 0.010" and 0.020 (0.125mm, 0.25mm and 0.50mm).
Features and Benefits
- Reusable; break and make interface connection many times
- Low thermal resistance at low pressures
- Naturally tacky at room temperature, no adhesive required
Applications
- Microprocessors
- Chipsets
- Graphics processing units
- Custom ASICS
- Power components and modules
- Testing systems
T-mate 2900 Series Product Tables
Specification Sheets and Brochures
- T-mate™ 2900 Series Specification Sheet
- T-mate™ 2900 Series Product Options
- Product Testing Procedures
- T-mate™ 2900 Directions For Use
- T-mate™ 2905 Thermal Failure Test
- T-mate™ 2905C RoHS Test Report
- T-mate™ 2910 RoHS Test Report
- T-mate™ 2920 RoHS Test Report
- T-mate™ 2900 Series MSDS Sheet
