T-gard™ 200 Series
T-gard™ 200 is a high performance interface pad. T-gard™ 200 consists
of a silicone/boron nitride composite. T-gard™ 200 interface pads are
used when the lowest thermal resistance and highest dieletric strength
are required. T-gard™ 200 is a fiberglass-reinforced material.
It is tough and strong, resulting in a high-tear, cut-through and puncture
resistant product. Burrs pose no problem for this material. T-gard™ 200 will not dry out, crack, or fail when pressured between mating parts.
T-gard™ 200 is available in 0.010" (0.25mm), 0.020" (0.51mm) and
0.030" (0.75mm) thicknesses.
Features & Benefits
- High thermal conductivity of 5 W/mK
- High dielectric strength of >6,000 volts
- Resistant to tears and punctures
- UL 94 V0 rated
Applications
- Audio and video components
- Automotive control units
- General high pressure interfaces
- Motor controllers
- Power conversion equipment
- Power semiconductors – T0 packages, MOSFETs and IGBTs
Technical Specifications
Click icon to access technical product specifications
Specification Sheets & Brochures
- T-gard™ Product Line Specification Sheet
- T-gard™ 200 Specification Sheet
- T-gard™ 200 MSDS Sheet
- T-gard™ 200 Reliability Report
