T-flex™ 600 Series
Product Data Table
Highly Compressible Gap Filler with 3.0 W/mK
T-flex™ 600 Seriesis an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, T-flex™ 600 recovers to over 90% of its original thickness after compression under low pressure.
T-flex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. T-flex™ 600 is electrically insulating, stable from -45°C to 200°C and meets UL 94V0 rating.
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