Laird Technologies

T-lam™ System - Thermally Conductive Circuit Board Materials

T-lam™ thermally conductive printed circuit boards use T-preg™ dielectric sheets in conjunction with copper foil and an integral metal base to provide circuit board laminate that has superior thermal management capabilities when compared to conventional FR4-based printed circuit boards (PCBs).

T-preg™, a free standing thermally conductive dielectric sheet, facilitates single layer, multilayer and FR4-hybrid construction.

T-preg™ is the only high thermal conductivity free-standing pre-preg available.

Our engineers routinely work with OEMs and fabricators to design circuit boards using the T-lam™ System.

Prototypes are available.

Features and Benefits:

Applications:

Products

 

T-PREG™ 1KA PERFORMANCE PROPERTIES

Typical Cured Properties (no fiberglass) T-preg™ 1KA*
Thermal Conductivity, W/m C† 3
Dielectric Strength, Volts/mil 800
Dielectric Constant 4.2
Lap Shear, Al/Al, psi 1,400
Peel Strength, Cu foil, pli 4-6
Hardness, Shore D 76
Flexural Strength, mPa 50
Elongation, % 0.51
Volume Resistivity, ohm-cm 1.2 x 1014
Surface Resistivity, ohms 1.0 x 1010
Comparative Tracking Index 600
Water Absorption, āˆ† weight % 0.10††
Cure Schedule, °C/hours 170/0.75
Continuous Use Temperature, °C 110-130
Intermittent Use Temperature, °C 250
Shelf Life, °C/Months (uncured pre-preg) 20/6
Color Green

*UL recognized 94-V-0 file E165095
† Bulk Value †† After 168 hours

Copper Foil Properties - HTE Copper - 1⁄2 oz. to 6 oz.

Metal Base-Plate Properties

Base-Plate Material Thermal Expansion Coefficient
ppm/°C
Thermal Conductivity
Zaxis/watts/m°C
Thermal Resistance
at 63 mils
°C-in²/watt
Aluminum 24 173 0.0143
Copper 18 260 0.0095

Metal Base-Plate Thickness 0.031 - 0.250 inches

Specification Sheets & Test Reports

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Laird Technologies