Laird Technologies

PC Board Level Shields

Board level shields provide isolation of board level components, minimizes crosstalk and susceptibility without impacting system speed.  Board level shielding products include the traditional metal enclosures of two piece, single piece, EZ Peel and our new combo products.  The combo products incorporate a stamped metal housing and an over-molded electrically conductive elastomer that is designed to meet the specific needs of your application.

Laird Technologies is well-known for delivering quick engineering design assistance, rapid prototyping, in-house tool design, automated packaging and top quality systems.

All dimensions shown in inches (millimeters) unless otherwise specified
Product Highlights • Custom shapes available
• Provides isolation of board level components
• Minimizes crosstalk and susceptibility without impacting system speed
• Available in tape or reel for automated pick and place applications
• Removable lid for component access
• Also available in EZ Peel removable lid style one-piece construction
SHIELDING EFFECTIVENESS
Transfer Impedance (500 MHz)
-
H-field (200 KHz) Mil 285 48 dB
Plane Wave (2 GHz) Mil 285 40 - 60 dB
Surface Resistivity N/A
Volume Resistivity N/A
Available Size Range Fence and lid: 0.130 - 1.00 (3.3 - 25,4) Height 6.000 (152,4) Width. One piece construction: 0.04 - 0.25 (1,0 - 6,4) Height 0.250 - 0.375 (6,35 - 9,53) Width
Deflection Operating Range N/A
Compression Force
(based on shape selection)
N/A
Compression Set N/A
Joint Unevenness Accommodation N/A
Compound/Material Availability Tin plated phosphor bronze, tin coated steel, stainless steel, brass, CuBe, and nickel silver
Other materials also available
Temperature Range Withstands reflow and solder temperature
Available Profiles Squares, rectangles, L-shapes, 90° inside corners
Mounting Methods Surface mount/through hole, various pin styles available
Custom Shapes Available Flexible fence with flat lid, photo etched flat blanks for hand forming, solid can construction, supplied with dividers to provide isolation
Fluid Seal N/A
Air/Dust N/A
Galvanic Compatibility Compatible with all solder materials
Typical Applications
for Shielding Gaskets
• All applications requiring shielding of board level components
• Low height down to 0.04 (1,0) to accommodate mother/daughter board configurations
• Secure cover design ideal for applications that could be subject to shock & vibration such as mobile military vehicles, commercial aircraft, & wireless electronics
• EZ Peel provides access to shielding components


the Application Request/Send CommentsLiterature Request
Laird Technologies