Form-In-Place
Form-in-Place is an automated system for dispensing conductive elastomer shielding, grounding and environmental gaskets onto metal or plastic substrates. Gaskets can be dispensed onto any conductive painted, plated or metallic surface of an electronics enclosure to protect it internally and externally from radiated interference and environmental elements. Typical applications include wireless handsets, PDA’s, PC cards, telecom base stations, satellite radios, navigation systems and test equipment.
| All dimensions shown in inches (millimeters) unless otherwise specified |
|
| Product Highlights | • Small consistent bead can be applied to thin walls, saving labor and eliminating material waste • Soft compressible materials • Effective alternative to traditional application of gaskets • Automated process capable of irregular shapes and tight tolerances • Dispense on metal or plastic |
| SHIELDING EFFECTIVENESS Transfer Impedance (500 MHz) |
85 to 120 dB |
| H-field (200 KHz) Mil 285 | 50 to 70 dB |
| Plane Wave (2 GHz) Mil 285 | 70 to 100 dB |
| Surface Resistivity | N/A |
| Volume Resistivity | 0.002 to 0.015 ohm-cm |
| Available Size Range | Height: 0.014 to 0.090 (0,36 to 2,3) Width: 0.015 to 0.125 (0,38 to 3,1) |
| Deflection Operating Range | 15 to 20% Deflection |
| Compression Force (based on shape selection) |
1.5 Lbs./lin. (0,27 Kg/cm) @ 0.022 (0,56) height @ 20% deflection |
| Compression Set | <20% @ 50% Deflection |
| Joint Unevenness Accommodation | 0.002 to 0.006 (0,05 to 0,15) |
| Compound/Material Availability | Elastomer Silicone fillers: Ag/AI, Ag/Cu, Ag/Glass, Ag/Ni, Ni, Ni/Graphite |
| Temperature Range | -58 to 257°F (-50 to 125°C) |
| Available Profiles | "D" Shape Bead |
| Mounting Methods | Directly applied to mounting surface |
