Drawn Can Board Level Shields
Laird Technologies has added Drawn Cans to its extensive list of board level shielding solutions. As microprocessor speeds continue to increase, so does the potential for EMI leakage through the smallest apertures in board level shields. Laird Technologies’ Drawn Cans are designed to provide additional near field and far field circuit isolation (attenuation) at higher frequencies by eliminating the apertures found in the corners of traditional BLS solutions. Drawn cans utilize small ground trace sizes, thereby preserving packaging space on the PC board.
Features and Benefits
- Solid corner designs when additional circuit isolation (attenuation) is required at higher frequencies
- Available in heights up to 0.250” (6.350 mm) with length and width dimensions from 0.300” (7.620 mm) to 2.000” (50.800 mm)
- Unlimited configurations of ventilation holes can be incorporated into the design
- Tape and reel packaging provides an economical and automated SMT attachment method
- Available in cold-rolled steel, brass, stainless steel, and nickel silver
- Multi-compartmental shielding of components can be achieved with formed partitions
- Mold-In-Place and Form-In-Place Elastomers can be combined with drawn cans to achieve shielding of multiple components with a single part
- Available with an EZ Peel scored lid feature; allows for easy top section removal for component repair and re-sealing
Laird Technologies can custom design a shield specifically to meet your requirements or we can utilize your approved design.
