EZ Peel™ Standard Board Level Shields
For Quick and Easy Access to Board Level Components
EZ Peel™ shields have a solid top, scored to allow peel-off when access to board level components within the shield is required.
The peel-off feature prevents damage to the board and components by eliminating the need for labor intensive de-soldering which can often result in increased scrap. Peeling off the cover is accomplished by using a small starter hole for simple removal. This hand operation requires minimal force using a hook scriber or tweezers.
After repair, replacement or adjustment of internal components, the shield can be resealed using a replacement cover.
Laird Technologies offers two replacement cover options: a snap-in cover and a dish cover.
The snap-in cover utilizes a lance and hole design. The replacement cover snaps into place and locks into a lance feature on the frame of the original board.
The dish cover option gets soldered into place on the board. The dish shape allows for self-location of the cover for soldering.
Benefits and Features
- Can be packaged in tape and reel formats for easy SMT installation using conventional pick-and-place equipment
- Easy removal of scored cover area
- Only 1.5 lbs. force for cover removal
- Simple replacement technique for cover
- Use on surface mount or through-hole applications
- Shield retains all physical properties after PCMCIA/JEIDA testing for shock, bending, torque, drop and vibration
- CRS 1008/1010 (tin plated) for solderability
EZ Peel™ Replacement Lid Options
EZ Peel Shield Part Number |
Snap-In Lid No. |
Dish Lid No. |
97-2002 |
97-2007 |
97-2014 |
97-2003 |
97-2006 |
97-2013 |
97-2004 |
NA |
97-2016 |
97-2005 |
97-2008 |
97-2015 |
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