Looking for an insulator pad that thermally conducts and, unlike many common solutions available today, is easy to use into the bargain?

If so, then help is at hand. From Thermagon, a unit of Laird Technologies, the world’s leading provider of thermal management technology, comes the T-gon™ CP200 and CP230 mid-grade thermally conductive insulator pads. Using these in a wide variety of electronic applications throughout industry, and elsewhere, will enhance heat transfer – and, therefore, promote cooling – by eliminating air gaps between hot components such as power semiconductors, and heat sinks or housings.

When a component – such as an electronic device – is brought into contact with a heatsink, research has shown that the average contact area can be as low as 2%, with the rest being a small but definite air gap. Air is a very poor thermal conductor and so the flow of heat from the hot component to its heatsink is restricted. The air gap must be filled with a thermally conductive medium so as to obtain the best performance from a heatsink and to keep the operating temperature of the component to a minimum. Thermally conducting pads, such as T-gon™, provide the answer. These are relatively soft and designed to conform to the contours of the two surfaces thus reducing the thermal resistance between the components. In this way, heat transfer is greatly increased, and the life of the electronic component is extended.

However, keeping things cool is not the only advantage of T-gonTM pads; they can also provide electrical insulation up to 5,500V if required.

T-gon™ CP200 is 0.200mm thick, while T-gonTM CP230 is 0.230mm thick. Both are made from glass-fibre covered with a ceramic powder filled silicone, a design that gives many excellent performance characteristics– high thermal conductivity, excellent dielectric strength and a wide temperature operating range (-60 to +180oC) - tailor-made for many thermal conduction applications.

Additional benefits of choosing Thermagon’s T-gon™ pads are that they feature an extremely high chemical resistance – important in many industrial applications – all with great long-term stability, and they are very resistant to tears and punctures.

Those used to working with traditional thermally conductive products, will welcome the availability of T-gon™ pads, as they are far easier to use – available pre-cut into standard or custom shaped profiles to suit the application, yet still provide good thermal performance. The pads can be coated, if required, with a pressure-sensitive adhesive for easy attachment to substrates such as heat sinks. This unique adhesive blend also contains its own thermal particles, so that thermal resistance is still further reduced.

Specific applications for these UL 94 V0 rated products include power semiconductors (T0 packages, MOSFETS, IGBTs etc), power conversion equipment, audio and video components, automotive control components, motor controllers / drives, general high pressure interfaces, they are however, appropriate for use in any electronic equipment where heat transfer is important.

Thermagon’s T-gon™ CP200 (coloured a light blue / green) and T-gon™ CP230 (coloured pink rose) thermally conductive pads are also available in 300mm X 300mm sheets.

Whatever the problem, Laird Technologies can design a solution.

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