IT / Computer
The evolution of computing and IT equipment in recent years has led to dramatic increases in processing power, data rates, connectivity, display size and quality - all of which increase the likelihood of EMI and thermal management issues, as well as creating the need for robust RF (radio frequency) solutions.
Laird continues to meet these challenges by offering the broadest range of solutions available, from Fabric-over-Foam (FoF) gasket for displays, system housings and cabinets through to a diverse selection of technologies to tackle other shielding or grounding needs. We also design custom board-level shielding (BLS) and ground contact parts for main boards, peripheral boards, and wireless cards, as well as routers, gateways, and access points.
We help customers solve difficult problems such as using absorber sheets to suppress EMI from high-frequency chipsets in computers and wireless devices. We also make board-level and cable core ferrite components to solve conducted and coupled EMI issues at source, including ferrite chip beads for processor signal and data lines, inductors for I/O connectors, and custom cable cores for power and data cables in PCs, printers, and other peripheral and accessory devices.
Our leadership in thermal solutions for computing, especially notebook PCs and servers, is well known throughout the industry, and we produce world-class thermal solutions, such as phase-change thermal interface materials (TIMs), for the most powerful PC processors.
As IT infrastructure becomes increasingly dependent on wireless (WLAN) networking, Laird has further extended its deserved global reputation for designing high-performance antennae for access points and client devices, offering both externally attached and embedded versions, often customized for OEM equipment customers. We also remain at the forefront of RFID (Radio Frequency Identification) technology, providing best-in-class antennas for readers used in warehouses and related applications.