T-Flex™ 500 Series
Highly Compressible Thermal Gap Filler with 2.8 W/mK
T-flex™ 500 is a highly compressible gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. T-flex 500’s unique silicone formulation has extremely low silicone extractables compared to other silicone interface materials and also meets NASA outgassing requirements.
T-flex 500 is naturally tacky, requiring no adhesive coating to inhibit thermal performance. T-flex 500 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94V0 rating.
Features and Benefits:
- Highly compressible and cost effective
- Low thermal resistance at low pressures
- Designed to have very low silicone extractables
- Meets NASA Outgassing requirements
- Available in 19 thicknesses 0.020” to 0.200”
- Naturally tacky needing no further adhesive coating
Applications:
- Cooling components to the chassis or frame
- High speed mass storage drives
- RDRAM memory modules
- Heat pipe thermal solutions
- Automotive engine control units
- Telecommunications hardware
T-flex 500 Series Data Tables
- T-flex 500 Series 520 - 550
- T-flex 500 Series 560 - 590
- T-flex 500 Series 5100 - 5130
- T-flex 500 Series 5140 - 5170
- T-flex 500 Series 5180 - 5200 and Test Methods
- Product Options
- Product Testing Procedures
Specification Sheets & Brochures
- T-flex 500 Series Spec Sheet
- T-flex 500 Series SGS Test Report
- T-flex 500 Thermal Cycling Report
- Gap Filler Product Line Spec Sheet
