T-pli™ 200 Series
Industry Leading Soft Elastomer Gap Filler
T-pli 200 Series™ is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies' highest performing interface pad.
T-pli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. T-pli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. T-pli is electrically insulating, stable from -45°C to 200°C, and meets UL 94HB rating.
Features and Benefits:
- Thermal performance leader
- 6 W/mK thermal conductivity
- Soft and compliant
- Available in 22 thicknesses from 0.010" (0.25 mm) to 0.200" (5.00 mm)
Applications:
- Notebook computers
- Handheld portable electronics
- Micro heat pipe thermal solutions
- Micro processors, memory chips and graphic processors
- Automotive engine control modules
- Wireless communication hardware
T-pli 200 Series Data Tables
- T-pli 200 Series 210 - 220
- T-pli 200 Series 225 - 250
- T-pli 200 Series 260 -290
- T-pli 200 Series 2100 - 2130
- T-pli 200 Series 2140 - 2170
- T-pli 200 Series 2180 - 2200
- Product Options
- Product Testing Procedures
Specification Sheets & Brochures
- T-pli 200 Series Spec Sheet
- T-pli 200 SGS Test Report
- T-pli 210 SGS Test Report
- T-pli 220 SGS Test Report
- T-pli 225 SGS Test Report
- T-pli 240 SGS Test Report
- Gap Filler Product Line Spec Sheet
