T-lam™ System - Thermally Conductive Circuit Board Materials

T-lam™ thermally conductive printed circuit boards use T-preg™ dielectric sheets in conjunction with copper foil and an integral metal base to provide circuit board laminate that has superior thermal management capabilities when compared to conventional FR4-based printed circuit boards (PCBs).

T-preg™, a free standing thermally conductive dielectric sheet, facilitates single layer, multilayer and FR4-hybrid construction.

T-preg™ is the only high thermal conductivity free-standing pre-preg available.

Our engineers routinely work with OEMs and fabricators to design circuit boards using the T-lam™ System.

Prototypes are available.

Features and Benefits:

ROHS Complaint Pre-Preg
Standard FR-4 print and etch processing
Low thermal resistance
Highest temperature rating
Available in multiple thicknesses
UL recognized materials File No. E165095

Applications:

Automotive engine control modules, ABS brakes and power steering modules
LED lighting modules
Motor controls
Power conversion devices
Servers and desktop computers

Products

T-PREG™ 1KA PERFORMANCE PROPERTIES

Typical Cured Properties (no fiberglass)	T-preg™ 1KA*
Thermal Conductivity, W/m C†	3
Dielectric Strength, Volts/mil	800
Dielectric Constant	4.2
Lap Shear, Al/Al, psi	1,400
Peel Strength, Cu foil, pli	4-6
Hardness, Shore D	76
Flexural Strength, mPa	50
Elongation, %	0.51
Volume Resistivity, ohm-cm	1.2 x 10
Surface Resistivity, ohms	1.0 x 10
Comparative Tracking Index	600
Water Absorption, ∆ weight %	0.10††
Cure Schedule, °C/hours	170/0.75
Continuous Use Temperature, °C	110-130
Intermittent Use Temperature, °C	250
Shelf Life, °C/Months (uncured pre-preg)	20/6
Color	Green

*UL recognized 94-V-0 file E165095
† Bulk Value †† After 168 hours

Copper Foil Properties - HTE Copper - 1⁄2 oz. to 6 oz.

Metal Base-Plate Properties

Base-Plate Material	Thermal Expansion Coefficient ppm/°C	Thermal Conductivity Zaxis/watts/m°C	Thermal Resistance at 63 mils °C-in²/watt
Aluminum	24	173	0.0143
Copper	18	260	0.0095

Metal Base-Plate Thickness 0.031 - 0.250 inches

Specification Sheets & Brochures

T-lam™ System Specification Sheet