T-flex™ 600 Series
Highly Compressible Gap Filler with 3.0 W/mK
T-flex 600 Series™ is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, T-flex 600 recovers to over 90% of its original thickness after compression under low pressure.
T-flex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. T-flex 600 is electrically insulating, stable from -45°C to 200°C and meets UL 94HB rating.
Features and Benefits:
- Very high compressibility for low stress applications
- 3.0 W/mK thermal conductivity
- Available in 19 thicknesses 0.020” (0.5mm) to 0.200” (5.0mm)
- Naturally tacky needing no further adhesive coating
- Release coating available on one side
Applications:
- Cooling multiple components to the chassis or frame
- High speed mass storage drives
- RDRAM memory modules
- Heat pipe thermal solutions
- Automotive engine control units
- Telecommunications hardware
- Optic fiber transmission hardware
T-flex 600 Series Data Tables
- T-flex 600 Series 620 - 650
- T-flex 600 Series 660 -690
- T-flex 600 Series 6100 - 6130
- T-flex 600 Series 6140 - 6170
- T-flex 600 Series 6180 - 6200 and Test Methods
- Product Options
- Product Testing Procedures
Specification Sheets & Brochures
