Laird Technologies

Fabric-Over-Foam EMI Shielding Gaskets

Profile and Input/Output (I/O) EMI shielding gaskets are available in UL94 V0 and HB flame retardant material. Laird Technologies specializes in quick turnaround of custom shapes and sizes of EMI shielding gaskets. Profiles can be cut to specified lengths, kiss-cut release liner or mitered to form frame configurations.

Features and Benefits

Applications

Product Specification Overview

Products

Fabric*

Fabric Types Metal Coating Conductivity (ASTM F390) Application Benefits
Ripstop Ni/Cu, Sn/Cu

<0.07 ohms/square

I/O or profile gaskets Complex shapes, flame retardant, shear resistance
Taffeta Ni/Cu <0.07 ohms/square Profile gaskets Complex shapes, flame retardant
Knit Mesh Ni/Cu <0.1 ohms/square I/O gaskets Low cost, flame retardant

 

Foam*

Foam Types Compression Set (ASTM D3574) Color Application Benefits
Urethane 5 to 10% Charcoal or tan I/O or profile gaskets Flame retardant, low compression gasket, complex shapes
Thermoplastic Elastomer (TPE) <20% Off white Profile gaskets Complex shapes, flame retardant

 

Pressure Sensitive Adhesive*

Pressure Sensitive Adhesive 180° Peel Strength on Stainless Steel (ASTM D-3330) Application Benefits
3M™ 9485 or equivalent 75 oz./in. (82N/100mm) High tack, shear resistant High peel strength and temperature resistant
Nitto D5052 or equivalent 87 oz./in. (95N/100mm) High tack, shear resistant High cohesive strength, high peel strength and temperature resistant

 

Other Pressure Sensitive Adhesives can be provided. Contact Engineering for assistance.

The recommended operating compression for Fabric-Over-Foam EMI gaskets vary depending on the shape and size of the gasket.

Typically D-Shaped, Rectangular Shaped and Square Shaped Fabric-Over-Foam EMI gaskets should be compressed between 30% and 50% of the foam height.

C-Shaped Fabric-Over-Foam gaskets should be typically compressed between 50% and 75% of the gasket height.

Force Displacement Resistance (FDR) graphs are available upon request.

*Certain combinations of materials may not be available for all profiles or I/O gaskets. Please consult with Engineering when unsure.

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