Laird Technologies

Conductive Foam

Conductive Foam offers an innovative approach to traditional shielding and grounding by providing X, Y and Z axis conductivity which enhances the shielding effectiveness required to meet the increasing microprocessor speeds of today's computer, telecommunications and aerospace equipment.

Conductive Foam is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors. Rectangular strips are available for perimeter gasketing applications.

Features and Benefits

Applications

Product Specification Overview

*Product Performance/ Physical Properties

X-Y Axis Surface Resistivity (ASTM F390) < 0.5 ohms/square
Z-Axis Resistivity (APM 130) <0.2 ohms/square inch
Shielding Effectiveness (MIL-DTL-83528C Mod) >90 dB (200 MHz to 10GHz)
Abrasion Resistance (ASTM D3886) >1,000,000 cycles
Service Temperature -40° - 158°F (-40 - 70°C)
Pressure Sensitive Adhesive 180 Degree Peel Strength (ASTM D3330 Mod.) Conductive: 30 ounces/inch width (only when PSA is used)

*Results vary depending on part design. Shielding effectiveness must be verified for specific applications. Please contact Engineering for assistance.

Conductive Foam Gasket Tolerances

Profile Tolerance Inches (Millimeters)
Height and Width

+ .020 (0.5)

For thicknesses < 3.2mm

 

Length Inches (Millimeters) Tolerance Inches (Millimeters)
1 to 6 (25.4 - 152.4) + .030 (0.8)
6 to 11 (152.4 - 279.4) + .050 (1.3)
11 to 48 (279.4 - 1219.2) + .100 (2.5)
48 to 70 (1219.2 - 1778.0) + .187 (4.7)
70 to 96 (1778.0 - 2438.4) + .250 (6.4)

Consult with Engineering on other lengths

Pressure Sensitive Adhesive

Pressure Sensitive Adhesive
180° Peel Strength on Stainless Steel
Temperature Resistance
Application
Thickness
Conductive
30 oz./inch width
-40 - 158°F (-40 - 70°C)
I/O backplane profile gaskets
2 mils (.051)

 

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