T-putty™ 502 Series
Product Data Tables
Ultra Compressible Thermal Gap Filler with 3.0 W/mK
T-putty™ 502 Series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness.
T-putty™ 502 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, T-putty™ 502 has a high thermal conductivity that results in very low thermal resistance.
T-putty™ 502 is naturally tacky and requires no further adhesive coating, which would inhibit thermal performance. T-putty™ 502 has a hardness of 5 (Shore OO), is electrically insulating, and is stable from -45°C to 200°C.
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