Laird Technologies Unveils Its T-Flex™ 300 Ultra Compliant, Thermal Gap Filler For Use in High-Speed Computing and Telecom Applications
Cleveland, OH. USA - (November 7, 2005) - Laird Technologies Thermal Products (formerly known as Thermagon) today introduced its T-flex™ 300 Series, the newest member of its T-flex family of thermally conductive gap fillers. T-flex 300 is a highly compressible gap filler designed to provide excellent thermal performance while remaining cost effective for state-of-the-art computer and telecommunications applications.
Providing the thermal transfer solution for heat issues that occur in high-speed devices, gap fillers, such as T-flex 300, are critical to ensuring component and device performance integrity. The T-flex 300 Series has a thermal conductivity of 1.2 W/mK, and its ultra-soft interface pad conforms well with minimal pressure, resulting in little or no stress on adjoining parts. Its compliancy is complemented with the lowest compression set of any gap filler currently available, enabling re-use of the same pad many times during re-work.
“Our T-flex 300 Series strengthens our existing line of extremely successful flexible gap filler products for high-volume manufacturing, and fortifies our position as the leading provider of thermal interface materials. The relatively elevated thermal conductivity and low cost make Laird’s T-flex 300 the best performing gap filler per unit cost on the market,” said Michael Dreyer, vice president and general manager of Laird’s Thermal Products Division. “The T-flex 300 design not only offers engineers and designers significant cost advantages, but also generates more flexibility with regard to assembly and provides architects the thermal capabilities needed to build next-generation electronic products. The T-flex 300 Series is targeted specifically at manufacturers of notebook computers, mobile telecommunication devices, high-speed mass storage drives, and numerous other applications that require increased thermal conductivity and large tolerance gap fillers.”
T-flex 300 is naturally tacky and does not need an additional adhesive coating that could inhibit thermal performance and increase cost. T-flex 300 can be supplied with a permanently attached metallized liner, which improves the material’s ease of use. This liner also provides a low friction surface for simpler re-work and assembly. It is available in thicknesses of 0.25mm to 5.08mm and is electrically insulating.
About Laird Technologies Thermal Products
Laird Technologies Thermal Products, a unit of Laird Technologies, is the leading supplier of high-performance gap filler thermal interface materials (TIM), and a growing provider of high-and-low performance thermally conductive greases, insulators, phase-change materials and insulated metal printed circuit boards. Formed in 2002 with Laird Technologies’ decision to build a strong presence in the market for thermal management products and solutions, the division was built on the strategic acquisitions of Thermagon Inc. in 2004, and Orcus Inc., Warth International in 2003. Leveraging Laird Technologies’ global presence, the Thermal Products unit has manufacturing, sales and technical support facilities in the United States, Taiwan, South and East China and the United Kingdom, as well as sales and technical support operations in Japan, Korea and Singapore. Laird Technologies Thermal Products division is based in Cleveland, Ohio.