Laird Technologies’ Thermal Management Expert to Present at AMD Technical Forum & Exhibition 2010

Presentation to Focus on High-Performance Thermal Interface Materials Solutions for Flat Panel Display Cooling

 

St. Louis, Missouri, USA – October 14, 2010 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced that one of its subject matter experts, Laird Technologies’ Product Director for Thermal Management - Asia, Vincent Tan, will make a presentation at the AMD Technical Forum & Exhibition 2010. The technical forum & exhibition is being held at the NTUH International Convention Center in Taipei, Taiwan, October 19, 2010.

Mr. Tan’s presentation will address the considerations that go into the development of advanced thermal solutions for flat panel display cooling, and how Laird Technologies’ high-performance thermal interface materials (TIMs) are leveraged into those solutions. The presentation will also include discussion on how the demand for flat panel displays has dramatically increased in consumer electronics, and where the focus for applications of flat panel displays for public information systems has been placed in recent years. Because these flat panel displays have been installed in various environments with various environmental conditions, the thermal characteristics of the display systems can be greatly affected in many ways. Therefore, the selection of the proper thermal management solutions in flat panel displays should be carefully considered in order to ensure the reliability of their embedded electronic systems.

AMD Technical Forum and Exhibition 2010 is the world’s first premier event that brings the academic and industry fields together in order to drive innovation at the platform level by implementing thinner, lighter and lower cost products with improved, highly efficient processor performance and reliability. This is achieved by enabling the ecosystem with open standards-based advancements in power engineering and thermal technologies. This global event exposes the computing industry community to unique opportunities in discovering how AMD is leading the way in the computing industry. It also provides a forum that highlights how AMD translates “technology” to “products”, and how it extends the capabilities of its customers.

As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, please logon to www.lairdtech.com.

Contact Information 

For additional information, visit http://www.lairdtech.com or contact us at:

Americas: +1-888-246-9050 option 2 or CLV-customerservice@lairdtech.com
Europe: +49-(0)-8031-2460-0 or TIM-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x374 or Thermal-ChinaSales@lairdtech.com

 

About Laird Technologies, Inc.

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.

Trademarks

© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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