As the global leader in providing high quality technological innovative solutions to a variety of industries, Laird is always improving and enhancing these components and systems to industry-leading standards.
St. Louis, Missouri, USA – September 15, 2010 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new rigid corner board-level shield (BLS).
Being the only company on the market offering this proprietary and patented (US Patent 7488902) shield design, Laird Technologies’ rigid corner board-level shield incorporates a new corner design that optimizes component rigidity for increased part and printed circuit board (PCB) firmness. As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall ruggedness and performance. The shield has improved solder joint reliability and resistance to solder joint fracture, especially in drop testing performance with thin PCBs. Several standard Laird Technologies EMI style parts including single-piece, two-piece, and multi-compartmental board-level shields now use this new rigid corner design, along with availability in custom sizes as well.
The new shield is stronger and more robust than traditional drawn shields, which results in coplanarity improvement of the solder castellations. The shield can tolerate more deflection (i.e., more handling) without plastic deformation. Elimination of drawn flange reduces the space needed on the PCB for shielding trace width by potentially ~0.3 mm, allowing for the shield to be more closely placed on the PCB. Elimination of draft allows for more undershield space and improved component clearance.
The partially drawn corner is located near the top portion the shield, resulting in improved torsional rigidity with no drawn lip and no draft. For parts over 2 mm, the corner is both drawn and formed with an interlocking multi-radius corner, which provides superior EMI shielding effectiveness. The interlocking corner can be meshed and closed in during the forming & drawing process for additional improved rigidity for parts taller than 2 mm. For parts under 2 mm, the entire corner is drawn without an interlocking corner.
“Laird Technologies’ new rigid corner board-level shield minimizes gaps through interlocking corners, which improves the EMI performance of the shield,” said John Noto, Laird Technologies Americas EMI Metals Product Manager. “The rigid corner increases structural stability, thus reducing the need for larger overhangs while increasing the coplanarity and visual inspection capabilities.”
As an industry-leading EMI solutions provider, Laird Technologies provides innovative board-level solutions with every available material and form factor for high-tech industries and applications around the world.
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-866-928-8181 or EMI-AmericasSales@lairdtech.comEurope: +49-(0)-8031-2460-0 or EMI-EUSales@lairdtech.comAsia: +86-755-2714-1166 x891 or EMI-AsiaSales@lairdtech.com
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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