Laird Technologies Releases Enhanced Tlam™ SS LLD Thermally Conductive PCB Substrate

Low-cost, High-performance Thermal Substrate Specifically Designed for LED Module Applications

 
TLAM SS LLD - 04-15-2010

St. Louis, Missouri, USA –April 15, 2010 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.

The Tlam SS LLD is a versatile, thermally-enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4-based PCBs; a key ability in keeping components cool.

A copper circuit layer and aluminum or copper base plate are bonded together with an LLD dielectric, which is essential to the high-performance of the PCB substrate. The dielectric can fit, and is processed through, standard FR4 print-and-etch operations without various parameter modifications. These dielectrics provide electrical isolation, thermal transfer, and an adhesion layer for the substrate.

“The enhanced Tlam SS LLD substrate improves thermal transference from the heat source to the heat sink through PCBs, reducing the thermal stress placed on the PCB,” commented Jeffrey Chuang, Laird Technologies Tlam Product Manager. “These new improvements benefit the LED market by providing a higher performing, lower cost thermal interface that extends operational life to the LED apparatus.”

The Tlam SS LLD boards are processed through standard pick-and-place surface mount technology (SMT) and manual wire bond operations. Standard constructions are made with one or two ounce copper and 0.040 (1) or 0.059 (1.5) inch (mm) thick aluminum, grade 5052; 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum, grade 6061; with a copper base available.

As the minimization of electronic devices continues to pack increasing power into smaller packages, Laird Technologies continues to excel at designing industry-leading, thermally-conductive PCB substrates for applications requiring the best thermal performance and resistance to thermal cycling.

Contact Information

For additional information, visit http://www.lairdtech.com or contact us at:

Americas: +1-888-246-9050 option 2 or CLV-customerservice@lairdtech.com
Europe: +49-(0)-8031-2460-0 or TIM-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x374 or Thermal-ChinaSales@lairdtech.com

About Laird Technologies, Inc.

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.

Trademarks

© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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