Laird Technologies to Present at SPIE Photonics West 2013

Company Will Exhibit Thermal Management Solutions

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 St. Louis, Missouri, USA – January 17, 2013 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending and presenting at SPIE Photonics West 2013. The event will be held at The Moscone Center in San Francisco, California, February 5-7, 2013. Laird Technologies will exhibit at booth #4642.  

In addition to exhibiting, Dr. Jeff Hershberger, Laird Technologies Staff Scientist and Technology Leader, will participate in a poster presentation session on Tuesday, February 5 from 6 p.m. to 8 p.m. Dr. Hershberger’s paper, “Efficient Thermoelectric Cooling of Concentrated Heat Loads” covers the improved efficiency of thermoelectric coolers (TECs) based on thermally conductive printed circuit boards (TCPCBs) when cooling concentrated heat loads. He will be on hand to discuss data results from testing the efficiency of TCPCB-based TECs compared to more traditional TECs with aluminum oxide printed circuit boards.  

During the exhibition, Laird Technologies will showcase a variety of Thermal Management Solutions including the eTEC Series, UltraTEC Series and OptoTEC Series thermoelectric modules, WL Series liquid exchanger systems, as well as the Tunnel Series and PowerCool Series thermoelectric assemblies. In addition to its own products, Laird Technologies has partnered with Nextreme Thermal Solutions, which will be exhibiting its thin film thermoelectric technology at the same booth. As part of the Laird Performance Materials (LPM) division, these products focus on providing vital protection to a wide range of devices.  

“Temperature stabilization of high powered laser devices is crucial to maintaining peak performance,” said Andrew Dereka, Laird Technologies Product Manager. “Laird Technologies provides a wide product breadth of thermal management solutions from thermal interface materials, thermoelectric modules to liquid cooling systems to address these complex heat load challenges.”   

SPIE Photonics West 2013 is the premier photonics and laser event covering biophotonics and biomedical optics, high-power laser manufacturing, optoelectronics, microfabrication and green photonics. During the exhibition, more than 1,200 companies will attend to see the latest products, tools, applications and to visit over 1,300 suppliers.  

As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. 

Contact Information 
For additional information, visit or contact us at: 
Americas: +1-888-246-9050 option 2 
Europe: +46-31-704-67-57
Asia: +86-755-2714-1166 x374

Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages. 

About Laird Technologies, Inc.

Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.


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