As the global leader in providing high quality technological innovative solutions to a variety of industries, Laird is always improving and enhancing these components and systems to industry-leading standards.
St. Louis, Missouri, USA – November 13, 2012 – Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the launch of a new version of AZTEC™, a thermoelectric module (TEM) simulation software.
AZTEC™ allows users to specify a given set of input variables based on application attributes and the program will select the optimal TEM(s) for trial. The program also contains an analysis worksheet, which simulates how the TEM(s) will function under a specific set of operating conditions. Available only online, the AZTEC™ tool is accessible from the Laird Technologies Website. Registration is required for first-time users by completing and submitting the online form and then following the software installation instructions.
“The product breadth of a TEM portfolio is very broad and it can be quite cumbersome for a thermal engineer to specify an optimal TEM based on a cross comparison of datasheets,” commented Andrew Dereka, Laird Technologies Product Manager. “AZTEC™ is a user-friendly tool that can speed up product development by running simulations on a TEM and viewing its expected output performance based on a given set of thermal and electrical operating points.”
The TEM Selection Tool in AZTEC™ uses input variables, such as heat load, ambient and control temperatures, input voltage requirement and thermal resistance of hot side heat exchangers to recommend an ideal TEM(s) needed to reach an application’s operating condition. The software has been updated with the latest TEM product offerings from Laird Technologies.
AZTEC™ also features an Analysis Worksheet Tool, which simulates the expected thermoelectric output parameters based on a given set of thermal and electrical operating points. Output parameters calculated include: the hot and cold side temperatures of the TEM, heat pumped at the cold surface of the TEM, coefficient of performance (COP) and input power requirements. The total hot side heat dissipation is also calculated, as it is beneficial in sizing a proper heat exchanger, which commonly mounts directly onto a TEM.
The Qc Estimating Worksheet within the program calculates an estimate on the heat load for device (spot) or chamber (volume) cooling applications. Computations are made based on input provided by the user such as temperature requirements, volumetric dimensions, insulation thickness, material properties and active heat load.
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.
Contact InformationFor additional information, visit http://www.lairdtech.com or contact us at:Americas: +1.888.246.9050Europe: +46.31.420530Asia: +86.755.2714.1166e-mail: email@example.com
Translations Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.
© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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