Emerson & Cuming Microwave Products, a Unit of Laird Technologies to Attend the 2012 International Microwave Symposium
Company to Display ECCOSORB®, ECCOSTOCK® and ECCOSHIELD®
St. Louis, Missouri, USA – June 11, 2012 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.
Three product lines from newly acquired Emerson & Cuming Microwave Products will be showcased at the event: ECCOSORB®, ECCOSTOCK® and ECCOSHIELD®. These solutions offer a wide range of microwave materials for engineers working with VHF, UHF, microwave and millimeter wave frequencies in industries including telecommunications, wireless, medical, automotive, electronics and military.
“We have the capability to engineer materials to precise configurations and formulate materials with specific electromagnetic properties,” said Doan Quach, Sales and Marketing Coordinator for Emerson & Cuming Microwave Products. “We offer customized solutions and IMS 2012 is an excellent opportunity to showcase our technology and why we are an industry-leader in EMI solutions.”
As an industry-leading EMI solutions provider, Laird Technologies has a complete portfolio of standard and customized EMI products for industries around the world. The addition of the ECCOSORB®, ECCOSTOCK® and ECCOSHIELD® product lines enhance Laird Technologies EMI solutions product offerings. For more information, white papers are available on the Theory and Application of RF/Microwave Absorbers and Application and Theory of Dielectric Materials in RF/Microwave Systems.
The 2012 International Microwave Symposium and Exhibition is the world’s largest gathering of RF and microwave professionals with over 12,000 attendees and more than 800 exhibitors. Attendees will have the opportunity to participate in technical sessions, application seminars, panel discussions and industrial exhibits.
Emerson & Cuming Microwave Products, a unit of Laird Technologies, is a global leader in the development and manufacture of microwave absorbing materials, low-loss dielectrics and electrically conductive shielding materials combining that absorber technology with a wide range of capabilities, in-depth knowledge of materials science, chemistry, microwave theory, and measurement techniques coupled with modern R&D laboratories , to offer high quality leading edge products and customized solutions. To learn more, visit the Emerson & Cuming Microwave Products, a unit of Laird Technologies booth or visit us at www.eccosorb.com and www.lairdtech.com.
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-866-928-8181 or EMI-AmericasSales@lairdtech.com
Europe: +49-(0)-8031-2460-0 or EMI-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x891 or EMI-AsiaSales@lairdtech.com
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
About Laird Technologies, Inc.
Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.
© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.