Laird Technologies to Attend SPIE Defense, Security and Sensing 2012 Conference and Exhibition

Company to Exhibit Thermoelectric Product Line

 
SPIRE Defese eTEC-HV14

St. Louis, Missouri, USA – April 13, 2012 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the SPIE Defense, Security and Sensing 2012 Conference and Exhibition with Nextreme Thermal Solutions. The conference will be held at the Baltimore Convention Center in Baltimore, Maryland, April 23-26, 2012. Laird Technologies will present at booth #232. Laird Technologies will showcase its high-performance thermoelectric product line which can be used to temperature stabilize optoelectronic components, lasers and sensors to maintain their peak performance or cool infrared systems and charged couple devices to low temperatures to maximize the light spectrum bandwidth.

Nextreme will showcase its thin-film eTEC and eTEG thermoelectric product lines. The miniature size and heat pumping capability make eTECs ideal for cooling laser diodes, photodiodes, infrared (IR) sensors, and other optoelectronic devices. Recent technology advancements deliver eTECs with a 60°C temperature difference at an ambient temperature of 25°C, bringing them on par with the performance of bulk thermoelectric technology. Nextreme’s thin-film eTEG thermoelectric power generators convert waste heat into electricity to power a wide range of devices including autonomous, self-powered security sensors and wireless transmitters for data acquisition.

Jim Mundell from Nextreme will be speaking on emerging applications and markets for thin-film thermoelectric energy harvesting. Advances in distributed sensors and sensor networks have led to an increased interest in the use of renewable power sources to replace or augment existing power systems.

About Nextreme Thermal Solutions™, Inc.  

Nextreme Thermal Solutions is a leading manufacturer of thin-film thermoelectric modules and sub-systems for growing markets worldwide. Micro-scale form factors, high power-pumping capabilities and a high-volume semiconductor manufacturing process enables low-cost, high-performance thermal management and energy harvesting solutions. For more information, visit www.nextreme.com.

Contact Information 

For additional information, visit http://www.lairdtech.com or contact us at:

Americas: +1-888-246-9050 option 2
Europe: +46-31-704-67-57
Asia: +86-755-2714-1166 x374
e-mail: CLV-customerservice@lairdtech.com 

About Laird Technologies, Inc.

Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.

Trademarks

© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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