As the global leader in providing high quality technological innovative solutions to a variety of industries, Laird is always improving and enhancing these components and systems to industry-leading standards.
St. Louis, Missouri, USA – October 10, 2011 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the publication of “Microchannel Heat Sink: Fabrication and Liquid Cooling System for High Heat Flux Integrated Circuits” by one of its own subject matter experts, Mechanical Engineer III, Shahi Riaz along with Dr. Dereje Agonafer a Professor at University of Texas at Arlington.
According to Mr. Riaz the thesis develops a closed-loop single-phase microchannel cooling system using de- ionized water as a coolant fluid for high heat flux integrated circuits.
“The book illustrates the analytical, computational fluid dynamics (CFD) and experimental studies of microchannel heat sink (MHS),” said Riaz. “It describes the fabrication process of MHS on a silicon wafer. It further demonstrates a liquid closed-loop system using MHS, pump, filter and heat exchanger.”
With the purchase of Kluver in March 2011, Laird Technologies was able to expand the scope of their thermal management business for usage in medical, telecommunications, and other end-use markets. By promoting an innovative culture and encouraging engineers to author technical papers and books Laird Technologies is able to combine experimental studies with an already broad product line to become one of the only companies offering a complete choice of solutions to these complex and critical temperature control applications. Shahi Riaz’s book comprehensively explains the aspects that lead to the design and optimization of Laird Technologies robust liquid cooling solutions and helps contribute to new product developments.
Shahi Riaz joined Laird Technologies in 2007 and is a Mechanical Engineer III in Cleveland, OH. He holds a masters degree in Mechanical Engineering and was awarded a U.S. Patent titled “Assemblies and Methods for Dissipating Heat from Handheld Electronics Devices” in June, 2011. His current responsibilities include the development of new products and/or materials that support current product lines or helps establish new product lines.
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.
For additional information, visit http://www.lairdtech.com or contact us at:
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Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.
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